LEAD FREE ASSEMBLY

It is no longer acceptable to ignore the complexity of the printed circuit board, the interaction between PCB Design, PCB Manufacture and PCB Assembly does have an effect on the product during its manufacturing life. Lead Free assembly temperatures have been shown to affect the pcb during the wave process and can cause de-lamination along with other assembly issues: tomb-stoning, copper dissolution, out gassing, pad cratering, poor wet out, etc.,.

Don't underestimate the contribution the PCB manufacture can make to reduce the potential of product failure or problems in the supply chain, Lyncolec has extensive experience in many areas of the supply chain and can project manage to ensure the customer has a single point of contact. Therefore consideration must be given to where the original order is placed. Single source/point of contact can eliminate many of the issues that can arise when things go wrong.

For many years the PCB has been seen as "Just a piece of fibre glass" and at times subject to a dutch auction with the lowest bidder winning the contract (Cheapest may not be the best option). This is no longer acceptable as complexity of designs increase, Hybrid Material Mixes, Blind via, High Lead Free Assembly Temperatures, High Speed Transmissions & many more relevant issues that will require each part of the supply chain to adopt Best Practice and understand the re-actions of each part of the supply chain on each part of the manufacturing process.

As part of the SC21 program (Supplier Chains of the 21st Century) Lyncolec is committed to improvement by communication in the whole  supply chain.

I hope the information below will give an understanding of the complexity and interaction of the PCB Designer the PCB Manufacture and the PCB Assembler.