Layer-to-Layer Registration Problems?

We at Lyncolec have invested in the highest level of technology to ensure layer-to-layer miss-registration is a thing of the past. Using state of the art x-ray drill allows us to post etch tool each layer thereby eliminating any material de-stabilisation after the etching process.

Post Bond

Each bonded panel is x-rayed and measured using sophisticated software that checks for any errors during the bond process, Built in Software will balance out any registration deviations before drilling tooling holes

March 09

Lyncolec took delivery of an Olec Double draw Glass to Glass exposure system that further enhances our registration with hole to pad of +-10/15 microns. This exposure system is capable of printing Inner Layers, Outer layers and Solder Resist