Increased accuracy of Layer to Layer & Hole to Pad

This highly accurate X-Ray system scans each layer prior to Inductive Pinless Welding, Measures and compensates for any material de-stabilisation that may have been encounted from the Etching Process thereby ensuring inner layer to layer registration. Each layer is then tooled on the X-Ray for layer to layer registration.

Once bonded every panel returns to the X-Ray system and is scanned to ensure the inner layer to inner layer registration is with in tolerance also at this stage the built in software optimise the drill data to pad registration thus ensuring complete drill to layer registration.

In built SPC (Statistical Process Control) software can feed data back to our QA department and Engineering Department

If at any stage during this process the registration dose not meet with the required tolerances set with in the software or customers requirements, our QA department will be informed and thus customers can be kept in the manufacturing loop at the earliest stage "Rather than half way through the manufacturing operation".